Test Development Engineer

Location
Bolton, Greater Manchester
Salary
Competitive hourly rates are being offered by the department.
Posted
25 Feb 2017
Closes
25 Mar 2017
Clearance Level
DV, None / Undisclosed, SC
Job Type
Contract

Test Development Engineer :

World class Defence Organisation based in Bolton is currently looking to recruit a Test Development Engineer.

Please Note: you must be eligible for SC Security Clearance.

The contract is initially for 6 months (ongoing thereafter). Competitive hourly rates are being offered by the department.

Test Development Engineer Job Description:

Design, manufacture and support of special to type electronics interfaces for automated test equipment.

• Test Development Engineer, responsible for design, circuit capture and PCB layout of special to type interface in accordance with project deadlines.
• Schematic design.
• PCB layout.
• Technical support to the test development team to facilitate system design and software. Electronics proving.
• Maintaining drawings and documents to high standard.
• HNC/HND (Electronics) Level of Qualifications or equivalent, plus substantial level of experience in Digital and Analogue Electronics Manufacture and Test.
• A good understand of measurement and test principles, and equipment. An understanding of RF and Microwave technology at subsystem level would be an advantage.
• Practical experience of schematic design, >100 components, across multiple sheets preferably using NI Multisim, other programs considered.
• Creation of new components both through-hole and surface mount, footprint and symbol. Practical experience of circuit board layout multi-layer design preferably using NI Ultiboard, other programs considered.
• ESD training.

Qualifications & experience required:

HNC/HND (Electronics) Level of Qualifications or equivalent, plus substantial level of experience in Digital and Analogue Electronics Manufacture and Test.

A good understand of measurement and test principles, and equipment.

An understanding of RF and Microwave technology at subsystem level would be an advantage.

Practical experience of schematic design, >100 components, across multiple sheets preferably using NI Multisim, other programs considered.

Creation of new components both through-hole and surface mount, footprint and symbol. Practical experience of circuit board layout multi-layer design preferably using NI Ultiboard, other programs considered.

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